| 发明名称 | Mechanism to attach a die to a substrate | ||
| 摘要 | A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process. | ||
| 申请公布号 | US9630269(B2) | 申请公布日期 | 2017.04.25 |
| 申请号 | US201314066989 | 申请日期 | 2013.10.30 |
| 申请人 | GLOBALFOUNDRIES INC. | 发明人 | Khanna Vijayeshwar D.;Shaikh Mohammed S. |
| 分类号 | H01L23/48;B23K3/08;H01L23/00;B23K1/00;B23K1/008;B23K101/40 | 主分类号 | H01L23/48 |
| 代理机构 | Roberts Mlotkowski Safran Cole & Calderon, P.C. | 代理人 | Cain David;Calderon Andrew M.;Roberts Mlotkowski Safran Cole & Calderon, P.C. |
| 主权项 | 1. A vacuum carrier, comprising: a frame having a first material compatible with a solder reflow process; a vacuum port extending from a top surface to an underside surface of the frame; and a seal mechanism comprising a second material different than the first material, attached to an edge on a lowermost surface of the frame of the vacuum carrier, wherein the frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process. | ||
| 地址 | Grand Cayman KY | ||