Expansion device placement apparatus

摘要

An apparatus that facilitates the accurate and uncomplicated placement of an adhesive circuit structure onto an integrated circuit card is described. The apparatus is configured to hold the adhesive circuit structure and an integrated circuit card such that the two components can be aligned for proper placement.

主权项

1. An apparatus comprising:
a retaining structure comprising a plurality of retaining elements, the retaining structure cooperatively structured with and configured to receive an integrated circuit card and an adhesive circuit structure comprising a circuit structure and an adhesive on the circuit structure; an opening in a retaining element in the plurality of retaining elements; and a cover portion coupled to the retaining structure, wherein the cover portion comprises a protruding portion that is at an underside of the cover portion and faces inwardly with respect to the retaining structure, the protruding portion configured to apply pressure to attach and bond the adhesive circuit structure to the integrated circuit card.