Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation

摘要

A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns. A method may include arranging extremities of first connectors or second connectors in a temporary layer before forming the partial encapsulation.

主权项

1. A microelectronic assembly, comprising:
first and second support elements each having first and second oppositely facing surfaces, the second surface of the first support element oriented towards the second surface of the second support element; a microelectronic element mounted to the second surface of a support element of the first and second support elements; terminals at the first surface of the first support element; electrically conductive first connectors projecting above the second surface of the first support element; electrically conductive elements at the first surface of the second support element; electrically conductive second connectors projecting above the second surface of the second support element and coupled to the first connectors; and a monolithic first encapsulation contacting the second surface of a support element of the first and second support elements, and contacting at least one of: the second surface of another support element of the first and second support elements, or a monolithic second encapsulation which contacts the second surface of the another support element, wherein each of at least some of the terminals is electrically coupled with an electrically conductive element of the electrically conductive elements through a first connector of said first connectors and a second connector of said second connectors.