发明名称 Transmitter and receiver integrated optical sub-assembly and optical module
摘要 A transmitter and receiver integrated optical sub-assembly includes a housing including a side wall structure and a bottom wall, a transmitter-side optical receptacle and a receiver-side optical receptacle attached to the side wall structure, a second circuit board inserted into the housing, laser diodes and photo diodes arranged on the bottom wall, a transmitter-side optical system that is disposed on the bottom wall and combines optical signals from the laser diodes, a receiver-side optical system that is disposed on the bottom wall and splits an optical signal from the receiver-side optical receptacle, a driver integrated circuit, and an amplifying integrated circuit. In the transmitter and receiver integrated optical sub-assembly, electrodes formed at the other end portion of the second circuit board are connected to the driver integrated circuit and the amplifying integrated circuit.
申请公布号 US9632260(B2) 申请公布日期 2017.04.25
申请号 US201615078952 申请日期 2016.03.23
申请人 Hitachi Metals, Ltd. 发明人 Mizobuchi Kenji;Takahashi Ryuta;Tamura Kenichi
分类号 H04B10/00;G02B6/42 主分类号 H04B10/00
代理机构 McGinn IP Law Group, PLLC 代理人 McGinn IP Law Group, PLLC
主权项 1. A transmitter and receiver integrated optical sub-assembly comprising: a housing that includes a box-shaped side wall structure having openings at its top and bottom in a height direction, anda bottom wall closing one of the openings at the bottom of the side wall structure; a transmitter-side optical receptacle and a receiver-side optical receptacle that are respectively attached to one and another of two through holes formed on one side of the side wall structure in a length direction which is perpendicular to the height direction; a circuit board that has one end portion inserted into the housing through a through hole for a board formed on another side of the side wall structure in the length direction and that has another end portion disposed outside the housing; a plurality of light emitting elements disposed on the bottom wall so as to be arranged in a row in a width direction which is perpendicular to the height direction and perpendicular to the length direction and a plurality of light receiving elements disposed on the bottom wall so as to be arranged in a row in the width direction; a transmitter-side optical system that is disposed in a region of the bottom wall between the transmitter-side optical receptacle and the plurality of light emitting elements and that combines optical signals incident thereupon from the plurality of light emitting elements into a signal so as to output the combined signal to the transmitter-side optical receptacle; a receiver-side optical system that is disposed in a region of the bottom wall between the receiver-side optical receptacle and the plurality of light receiving elements and that splits an optical signal incident thereupon from the receiver-side optical receptacle into signals so as to output the split signals to the plurality of light receiving elements; a driver integrated circuit that is disposed between the plurality of light emitting elements and the other side of the side wall structure in the length direction and that drives the plurality of light emitting elements; and an amplifying integrated circuit that is disposed between the plurality of light receiving elements and the other side of the side wall structure in the length direction and that amplifies electric signals from the plurality of light receiving elements, wherein the circuit board includes a plurality of electrodes arranged in the width direction at the other end portion of the circuit board, and wherein the plurality of electrodes are electrically connected to the driver integrated circuit and the amplifying integrated circuit through a wiring pattern formed on the circuit board.
地址 Tokyo JP