| 发明名称 | Desense reduction via pin remap in modular device | ||
| 摘要 | A modular device system is provided having a base portable electronic communication device. The base portable electronic communication device has a display side and a reverse side, and one or more antennas being located along one or more of the device edges. A ground element on the reverse side of the housing is adjacent to the antennas and is grounded to the chassis. A multi-pin connector array on the same side is located adjacent to the ground element and the ground element lies between the connector array and the antennas. The connector array includes multiple pins supporting multiple data speeds, and the high speed data pins are located closer to the array center than the low speed data pins. The array is configured and located to electrically connect to a mating array on a module device when the module device is mated to the base portable electronic communication device. | ||
| 申请公布号 | US9634774(B1) | 申请公布日期 | 2017.04.25 |
| 申请号 | US201615174561 | 申请日期 | 2016.06.06 |
| 申请人 | Motorola Mobility LLC | 发明人 | Mohammad Sayem Abu Taher;Abdul-Gaffoor Mohammed;Duong Minh H;Abedin Faisal |
| 分类号 | H04M1/00;H04B15/02;H04M1/02;H04M1/725;H04B1/10 | 主分类号 | H04M1/00 |
| 代理机构 | Miller, Matthias & Hull LLP | 代理人 | Miller, Matthias & Hull LLP |
| 主权项 | 1. A modular device system including a base portable electronic communication device comprising: a chassis; a housing at least partially encompassing the chassis, having a display side and a reverse side, and having top, bottom and side edges, wherein one or more antennas are located along one of the top, bottom and side edges; a ground element exposed on the reverse side of the housing and being adjacent to the one or more antennas, the ground element being electrically tied to the chassis; and a multi-pin connector array on the reverse side and being adjacent to the ground element such that the ground element lies between the connector array and the one or more antennas, the connector array having multiple pins supporting multiple data speeds between and including low speed data and high speed data, wherein the multi-pin connector array has a center and the high speed data pins are located closer to the array center than the low speed data pins, the multi-pin connector array being configured and located to electrically connect to a mating array on a module device when the module device is mated to the base portable electronic communication device. | ||
| 地址 | Chicago IL US | ||