Integrated circuit die with corner IO pads

摘要

An integrated circuit (IC) die has side input/output (IO) pads located along each side of the die interior. Each die corner has a corner IO pad. The side IO pads adjacent to the corner IO pads have shortened passivation regions in the top metal layer (TML) that define TML access regions. TML traces run through the TML access regions to connect the corner IO pads to the die interior. Providing corner IO pads enables an IC die to have up to four more IO pads than a comparable conventional IC die that does not have any corner IO pads, or an IC die to have the same number of IO pads within a smaller overall footprint.

主权项

1. An integrated circuit (IC) die comprising:
a die interior having four sides; a first set of side input/output (IO) pads located along a first side of the die interior; a second set of side pads located along a second side of the die interior adjacent to the first side at a first die corner of the IC die, wherein the first die corner has lateral dimensions; a first corner IO pad located within the first die corner, wherein a first adjacent side IO pad in the first set of side IO pads is adjacent to the first corner IO pad and had a first pad region that is shorter than the corresponding lateral dimension of the first die corner, thereby defining a first access region; and a first trace running through the first access region to connect the first corner IO pad to the die interior, wherein the first trace has a first leg that projects perpendicular from the first corner IO pad into the first access region, and a second leg perpendicular to the first leg that extends into the die interior.