Semiconductor device, solid-state image sensor and camera system

摘要

The present invention relates to a semiconductor device, a solid-state image sensor and a camera system capable of reducing the influence of noise at a connection between chips without a special circuit for communication and reducing the cost as a result. The semiconductor device includes: a first chip; and a second chip, wherein the first chip and the second chip are bonded to have a stacked structure, the first chip has a high-voltage transistor circuit mounted thereon, the second chip has mounted thereon a low-voltage transistor circuit having lower breakdown voltage than the high-voltage transistor circuit, and wiring between the first chip and the second chip is connected through a via formed in the first chip.

主权项

1. An imaging device comprising:
a first semiconductor substrate including:
a pixel array unit including a plurality of pixels,a plurality of signal lines, anda plurality of comparators, wherein at least one comparator of the plurality of comparators is coupled to at least one pixel of the plurality of pixels through at least one signal line of the plurality of signal lines; and a second semiconductor substrate laminated with the first semiconductor substrate, the second semiconductor substrate including:
a control circuit coupled to at least one pixel of the plurality of pixels through at least one via of a first plurality of vias disposed along a first side of the pixel array unit, anda plurality of counters, wherein at least one counter of the plurality of counters is coupled to at least one comparator of the plurality of comparators through at least one via of a second plurality of vias disposed along a second side of the pixel array unit.