| 发明名称 | Sealing epoxy resin composition, hardened product, and semiconductor device | ||
| 摘要 | A sealing epoxy resin composition contains a phosphonium salt shown in Formula (1), an epoxy resin, a hardening agent, and an inorganic filler. In Formula (1), R1-R3 each represent an aryl group having 6 to 12 carbon atoms, R4 represents an alkyl group having 1 to 4 carbon atoms, R6 and R8 each represent either a carboxyl group or a hydroxyl group, R5 and R7 each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms, R9 and R11 represent hydrogen, R10 represents either a carboxyl group or a hydroxyl group, and the relation of r≦1 is satisfied. | ||
| 申请公布号 | US9633922(B2) | 申请公布日期 | 2017.04.25 |
| 申请号 | US201615154956 | 申请日期 | 2016.05.14 |
| 申请人 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | 发明人 | Ogawa Kazuto;Nishidono Kyoko;Iwatani Emi;Takagi Keigo |
| 分类号 | H01L23/29;C08G59/62;C08G59/68;C08L63/00;C08K3/00;C08K5/50;C09J163/00;C08G59/24;H01L23/31;H01L23/495 | 主分类号 | H01L23/29 |
| 代理机构 | Greenblum & Bernstein, P.L.C. | 代理人 | Greenblum & Bernstein, P.L.C. |
| 主权项 | 1. A sealing epoxy resin composition comprising: a phosphonium salt shown in Formula (1); an epoxy resin; a hardening agent; and an inorganic filler, where R1-R3 are independent and each represent an aryl group having 6 to 12 carbon atoms; R4 represents an alkyl group having 1 to 4 carbon atoms; R6 and R8 are independent and each represent either a carboxyl group or a hydroxyl group; R5 and R7 are independent and each represent either hydrogen or an alkyl group having 1 to 4 carbon atoms; R9 and R11 represent hydrogen; R10 represents either a carboxyl group or a hydroxyl group; and a relation of 0≦r≦1 is satisfied. | ||
| 地址 | Osaka JP | ||