Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device

摘要

Disclosed is a signal transmission circuit device (200) including a feedback signal transmission unit (210) that feeds back a control output signal (Sout) as a feedback signal (Sf) to an input side circuit (200A). A logical comparison circuit (212) detects “mismatch” between input and output by performing logical comparison between a control input signal (Sin) and the feedback signal (Sf). When a state of “mismatch” between input and output occurs, a first pulse generating circuit (202) or a second pulse generating circuit (204) outputs a first correction signal (Sa1) or a second correction signal (Sa2) corresponding to a potential (high level or low level) of the control input signal (Sin), and corrects the control output signal (Sout) to the same potential (high level or low level) as the control input signal (Sin). With such configuration, the mismatch between input and output can be automatically corrected.

主权项

1. A semiconductor device in which
a first coil which functions as a primary side coil of a first transformer and a second coil which functions as a primary side coil of a second transformer are integrated, wherein a first current supply pad and a first voltage measurement pad are connected to an end of the first coil, a second current supply pad and a second voltage measurement pad are connected to the other end of the first coil, a third current supply pad and a third voltage measurement pad are connected to an end of the second coil, the second current supply pad and the second voltage measurement pad are connected to the other end of the second coil, the first current supply pad and the first voltage measurement pad are arranged side by side in a first direction, the third current supply pad and the third voltage measurement pad are arranged side by side in the first direction, and the second current supply pad and the second voltage measurement pad are arranged at a boundary between the first and second coils, and are arranged side by side in a second direction different from the first direction.