Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same

摘要

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

主权项

1. A solid state drive (SSD) comprising:
a case including a bottom surface having a first edge, a second edge, a third edge, and a fourth edge, the second edge of the bottom surface of the case being located opposite to the first edge of the bottom surface of the case, the case including side walls; a plurality of circuit board connection terminals along the first edge of the case; at least one securing element disposed on the bottom surface of the case of the SSD separately from the side walls of the case; a circuit board secured to the bottom surface of the case by the at least one securing element, the circuit board including a first surface having a first side opposite a second side of the circuit board; a plurality of connection terminals disposed along the first side of the first surface of the circuit board, the first side of the first surface of the circuit board being disposed closer to the first edge of the bottom surface of the case than the second edge of the bottom surface of the case, the second side of the first surface of the circuit board being closer to the second edge of the bottom surface of the case than the first edge of the bottom surface of the case, the plurality of connection terminals being connected to the plurality of circuit board connection terminals at the first surface of the circuit board via a conductor; and a first package disposed on the first surface of the circuit board, and having a width and a length that is equal to or greater than the width, the length being substantially perpendicular to the width, each of the length and the width being measured on a top surface of the first package, the top surface of the first package being substantially parallel with the first surface of the circuit board, wherein at least one of a memory and a memory controller is included inside the first package, a first distance is greater than the width of the first package, the first distance being a shortest distance between the second side of the first surface of the circuit board and the second edge of the bottom surface of the case, a second distance is greater than the width of the first package, the second distance being a shortest distance between the circuit board and the third edge of the bottom surface of the case, the first distance is greater than the second distance, the at least one securing element extends by edges of the circuit board between the first side and the second side and is entirely spaced from the second edge of the case, the at least one securing element is substantially spaced apart from each of the first edge, the second edge, the third edge, and the fourth edge of the bottom surface of the case, the at least one securing element forms a frame for engaging at least two sides of the circuit board to receive the circuit board by non-sliding motion into the case, and the circuit board is secured to the bottom surface of the case.