Component built-in board mounting body and method of manufacturing the same, and component built-in board

摘要

A component built-in board mounting body has a component built-in board mounted on a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and having an electronic component built in thereto, wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, and is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and a surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via and the thermal wiring, and is thermally connected to the mounting board via the bump.

主权项

1. A component built-in board mounting body that has a component built-in board mounted on a mounting surface of a mounting board, the component built-in board being configured having stacked therein, in a stacking direction, a plurality of printed wiring bases that each have a wiring pattern and a via, the wiring pattern being formed on a resin base thereof and the via being formed in the resin base thereof, and the component built-in board being configured having an electronic component built in thereto,
wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, wherein the thermal wiring and the thermal via are partially disposed at a position outside an outer periphery of the electronic component in a direction orthogonal to the stacking direction, and wherein the component built-in board is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and an opposite surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via, the thermal wiring, and the thermal wiring and the thermal via disposed at the position outside the outer periphery of the electronic component, and is thermally connected to the mounting board via the bump, wherein one printed wiring base of the plurality of printed wiring bases includes an opening receiving the electronic component, the thermal via disposed at the position outside the outer periphery of the electronic component penetrates the one printed wiring base in the stacking direction.