| 摘要 |
A disk with at least one connecting element having a connecting bridge, including; a substrate having an electrically conductive structure on at least one partial region of the substrate, at least one electric connecting element on at least one partial region of the electrically conductive structure, a connecting bridge on at least one partial region of the connecting element and a lead-free solder mass that connects the electric connecting element in at least one partial region with the electrically conductive structure, wherein the difference of the thermal expansion coefficient of the substrate and the connecting element is less than 5×10−6/° C., wherein the connecting bridge is formed in a massive manner and contains copper and wherein the material compositions of the connecting element and the connecting bridge differ. |
| 主权项 |
1. A pane with at least one electrical connection element with a connection bridge, comprising at least: a substrate with an electrically conductive structure on at least one subregion of the substrate, at least one electrical connection element on at least one subregion of the electrically conductive structure, a connection bridge on at least one subregion of the connection element, wherein the connection element contains at least 66.5 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, and one or more selected from the group of carbon, nickel, manganese, molybdenum, niobium, and titanium, and a leadfree solder material, which connects the electrical connection element to the electrically conductive structure in at least one subregion, wherein the difference between the coefficients of thermal expansion of the substrate and the connection element is less than 5×10−6/° C., wherein the connection bridge is implemented as a solid and contains copper, and wherein the material compositions of the connection element and the connection bridge are different. |
