Methods of forming image sensor integrated circuit packages

摘要

A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between image sensor dies, or on a removable panel in between transparent substrates attached to image sensor dies. Redistribution layers may be formed before or after the molding process. Mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, redistribution layers may be formed after the molding process and the redistribution layers may extend over the mold material. Image sensor dies may be attached to a glass or notched glass substrate with dam structures. The methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor.

主权项

1. A method of forming image sensor packages comprising:
attaching a plurality of dam structures to a transparent substrate; forming a plurality of conductive vias in an image sensor wafer having first and second image sensor dies; attaching the image sensor wafer to the plurality of dam structures; after attaching the image sensor wafer to the plurality of dam structures, separating the image sensor wafer into the first and second image sensor dies; attaching the first and second image sensor dies to an additional substrate, wherein attaching the first and second image sensor dies to the additional substrate comprises contacting first and second portions of the transparent substrate to the additional substrate, wherein the first image sensor die has first and second opposing surfaces, and wherein the second surface is interposed between the transparent substrate and the first surface; forming a redistribution layer contacting a conductive via of the plurality of conductive vias, wherein the redistribution layer is formed on the first surface of the first image sensor die; and after attaching the first and second image sensor dies to the additional substrate, performing a molding process by forming mold material in direct contact with the additional substrate in between the first and second image sensor dies, wherein performing the molding process comprises forming mold material in direct contact with the first surface of the first image sensor die, and wherein performing the molding process comprises forming mold material in direct contact with the redistribution layer.