Semiconductor device and manufacturing method of semiconductor device

摘要

A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.

主权项

1. A semiconductor device comprising:
a stacked unit including a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler having a second opening and a second coolant flow path that is connected to the second opening, the stacked unit being formed by the first cooler and the second cooler sandwiching the semiconductor module, and the stacked unit being stacked such that the first opening and the second opening face each other; a seal member being arranged between the first opening and the second opening that are adjacent in a stacking direction, and the seal member connecting the first opening and the second opening; and a winding member keeping pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit, wherein the winding member is welded to the plurality of coolers, and the winding member is a metal band, a plurality of welding holes are formed in positions facing the plurality of coolers, in the band, and the band is welded to the plurality of coolers, at peripheral edges of the plurality of welding holes.