Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition

摘要

Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises:
(A) a cyanate ester compound having not less than two cyanato groups in one molecule;(B) a phenolic compound;(C) at least one epoxy resin;(D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and(E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt.;A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.

主权项

1. A semiconductor encapsulation resin composition comprising:
(A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound represented by the following general formula (3): wherein in formula (3), m represents an integer of 0 to 10; each R5 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; each R6 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and each R7 independently represents a group selected from the divalent groups expressed by the following formulae: wherein in the above formulae, each R4 independently represents a hydrogen atom or a methyl group; (C) at least one of the epoxy resins represented by the following formulae (5) and (6): wherein in formula (5), R8 independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R9 independently represents a group selected from the divalent groups expressed by the following formulae; and p represents an integer of 0 to 10, and wherein in formula (6), R10 independently represents a group selected from the divalent groups expressed by the following formulae; j independently represents an integer of 1 to 6; and k represents an integer of 0 to 10 (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane represented by the following average formula (8)Ha⁢Rb11⁢SiO4-(a+b)2(8) wherein in formula (8), R11 independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; a is a positive number satisfying 0.01≦a≦1, and b is a positive number satisfying 1≦b≦3, provided that 1.01≦a+b<4; and (E) at least one kind of compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt represented by the following formula (9) wherein in formula (9), R15 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or a phenyl group; and n12 represents an integer of 1 to 3, and wherein a molar ratio of phenolic hydroxyl groups in said phenolic compound (B) to cyanato groups in said cyanate ester compound (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in said epoxy resin (C) and said component (D) to cyanato groups in said cyanate ester compound (A) is 0.04 to 0.25.