| 发明名称 | Impedance matching arrangement for an amplifier | ||
| 摘要 | An impedance matching arrangement for an amplifier includes first and second metallic transmission lines arranged on a ground plane, the first metallic transmission line being connected with a first power amplification stage of the amplifier, the second metallic transmission line being connected with a second power amplification stage of the amplifier; wherein the first and second metallic transmission lines are electrically coupled for transmitting an RF signal amplified by the first power amplification stage to the second power amplification stage. | ||
| 申请公布号 | US9634618(B2) | 申请公布日期 | 2017.04.25 |
| 申请号 | US201514803296 | 申请日期 | 2015.07.20 |
| 申请人 | City University of Hong Kong | 发明人 | Xue Quan;Zhang Haiwai;Shum Kam Man |
| 分类号 | H03F3/45;H03F1/56;H03F1/02;H03F3/19;H03F3/21 | 主分类号 | H03F3/45 |
| 代理机构 | Renner Kenner Greive Bobak Taylor & Weber | 代理人 | Renner Kenner Greive Bobak Taylor & Weber |
| 主权项 | 1. An impedance matching arrangement for an amplifier, comprising: first and second metallic transmission lines arranged on a ground plane, the first metallic transmission line being connected with a first power amplification stage of the amplifier, the second metallic transmission line being connected with a second power amplification stage of the amplifier; wherein the first and second metallic transmission lines are electrically coupled for transmitting an RF signal amplified by the first power amplification stage to the second power amplification stage; wherein the first and second metallic transmission lines together define a first coupled section at one end thereof, a second coupled section at another end thereof, and an uncoupled section between the first and second coupled sections. | ||
| 地址 | Hong Kong HK | ||