发明名称 Method for manufacturing liquid ejecting head
摘要 A method for manufacturing a liquid ejecting head including a laminate formed of a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, a first electrode, a piezoelectric layer, and a second electrode, the method including stacking the first electrode, the piezoelectric material, the second electrode, and a reinforcing member on top of one another to form a laminate; heating the laminate to form a piezoelectric layer made of the piezoelectric material; bonding the laminate to the flow path substrate on a first electrode side; and removing the reinforcing member.
申请公布号 US9634235(B2) 申请公布日期 2017.04.25
申请号 US201414222002 申请日期 2014.03.21
申请人 Seiko Epson Corporation 发明人 Zhang Junhua
分类号 C03B29/00;B29C65/00;H01L41/29;H01L41/335;H01L41/277;H01L41/273;H01L41/27;H01L41/083;B41J2/16;B41J2/14;C04B37/00 主分类号 C03B29/00
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A method for manufacturing a liquid ejecting head including a laminate formed on a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, the laminate including a first electrode, a piezoelectric material layer, and a second electrode, the method comprising: forming the laminate, wherein a piezoelectric material is formed on the first electrode, the second electrode is formed on the piezoelectric material, and a reinforcing member is formed directly on the second electrode, heating the laminate to form the piezoelectric material layer made of piezoelectric material, bonding the laminate to the flow path substrate on a first electrode side, and removing the reinforcing member, wherein in the removing of the reinforcing member, the reinforcing member in a predetermined region excluding a connection region is partially removed to leave the reinforcing member having a predetermined thickness; at least part of the reinforcing member and at least part of the second electrode in the connection region are removed to form a through hole, and an electrically conductive material is disposed in the through hole to form an electric conductor.
地址 Tokyo JP