发明名称 HEAT TRANSFER CHASSIS AND METHOD FOR FORMING THE SAME
摘要 A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.
申请公布号 US2017112020(A1) 申请公布日期 2017.04.20
申请号 US201514918082 申请日期 2015.10.20
申请人 General Electric Company 发明人 Krivonak Andrew Louis;Perlaguri Shreenath Shekar;Yammanuru Rajendra;Radhakrishnan Arunpandi;Brown Theodore Clark
分类号 H05K7/20;B23P15/26 主分类号 H05K7/20
代理机构 代理人
主权项 1. A system comprising: a front plate having a front side and a back side, the front plate defining multiple slots through the front plate between the front and back sides; a manifold cover secured to the front plate to define a fluid distribution chamber along the front side of the front plate, the manifold cover defining a port opening through which a cooling fluid is received from outside of the manifold cover; and bridge heat sinks extending rearward from the back side of the front plate, the bridge heat sinks defining fluid channels that are fluidly connected with the fluid distribution chamber through the corresponding slots of the front plate, wherein the fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.
地址 Schenectady NY US