| 发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
| 摘要 |
A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper. |
| 申请公布号 |
US2017111032(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615274473 |
申请日期 |
2016.09.23 |
| 申请人 |
MediaTek Inc. |
发明人 |
LIAO Chun-Neng;CHIANG Meng-Hsin;CHANG Chun-Wei;UNG Chee-Kong;LI Ching-Chih |
| 分类号 |
H04B3/28;H01P1/24 |
主分类号 |
H04B3/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor integrated circuit device, comprising:
a chip main circuit, coupled to a power source and performing a predetermined function; a damper, coupled to an output terminal of the chip main circuit; and a passive component, coupled to the chip main circuit via the damper. |
| 地址 |
Hsin-Chu TW |
