发明名称 |
HIGH VOLTAGE POWER MODULE |
摘要 |
A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module. |
申请公布号 |
US2017112005(A1) |
申请公布日期 |
2017.04.20 |
申请号 |
US201514918110 |
申请日期 |
2015.10.20 |
申请人 |
Cree, Inc. |
发明人 |
Cole Zachary;Passmore Brandon |
分类号 |
H05K5/00;H05K1/02;H01L29/78;H01L25/11;H01L29/16 |
主分类号 |
H05K5/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A power module comprising:
a first sub-module comprising a first power semiconductor die; a second sub-module comprising a second power semiconductor die; and a removable jumper coupled between at least one contact of the first power semiconductor die and at least one contact of the second power semiconductor die. |
地址 |
Durham NC US |