发明名称 HIGH VOLTAGE POWER MODULE
摘要 A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.
申请公布号 US2017112005(A1) 申请公布日期 2017.04.20
申请号 US201514918110 申请日期 2015.10.20
申请人 Cree, Inc. 发明人 Cole Zachary;Passmore Brandon
分类号 H05K5/00;H05K1/02;H01L29/78;H01L25/11;H01L29/16 主分类号 H05K5/00
代理机构 代理人
主权项 1. A power module comprising: a first sub-module comprising a first power semiconductor die; a second sub-module comprising a second power semiconductor die; and a removable jumper coupled between at least one contact of the first power semiconductor die and at least one contact of the second power semiconductor die.
地址 Durham NC US