| 发明名称 |
HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATING COMPONENT, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, INTEGRATED MODULE, AND INFORMATION PROCESSING SYSTEM |
| 摘要 |
A heat dissipating component including a main body formed from a first material, and a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that covers the main body, and that includes a fin, and a connecting portion that is thermally connected to the fin at a position other than an apex of the fin and is also thermally connected to an electronic component. |
| 申请公布号 |
US2017110386(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615391100 |
申请日期 |
2016.12.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
Suzuki Takashi;Nakagawa Kanae |
| 分类号 |
H01L23/373;H01L23/38;H01L23/367;H05K7/20 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat dissipating component comprising:
a main body formed from a first material; and a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that covers the main body, and that includes a fin, and a connecting portion that is thermally connected to the fin at a position other than an apex of the fin and is also thermally connected to an electronic component. |
| 地址 |
Kawasaki-shi JP |
