EXTERNAL GETTERING METHOD AND DEVICE

摘要

Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

主权项

1. A semiconductor wafer comprising:
a substrate having a device section for forming semiconductor devices and a backside section; and an external gettering element arranged adjacent said backside section of said substrate, said external gettering element comprising a gettering material for forming a denude zone at said device section.