发明名称 METHOD OF MEASURING THICKNESS, METHOD OF PROCESSING IMAGE AND ELECTRONIC SYSTEM PERFORMING THE SAME
摘要 A thickness of a first layer in a structure may be measured based on an original image of the structure. A first boundary of the first layer may be identified in the original image. A second boundary that is substantially indistinguishable in the original image may be identified based on converting the original image into a first image based on the first boundary and generating a second image based on filtering the first image. The first image may be generated based on adjusting partial image portions of the original image to align the representation of the first boundary with an axis line, such that the first image includes a representation of the first boundary that extends substantially in parallel with the axis line. The second boundary may be identified from the second image, and the thickness of the layer may be determined based on the identified first and second boundaries.
申请公布号 US2017109896(A1) 申请公布日期 2017.04.20
申请号 US201615252613 申请日期 2016.08.31
申请人 Samsung Electronics Co., Ltd. 发明人 Park Min-Chul;Lee Je-Hyun;Ko Jeong-Hoon;Kim Young-Gu;Lee Keun-Ho
分类号 G06T7/60;G06T5/00;G06T7/00 主分类号 G06T7/60
代理机构 代理人
主权项 1. A method of measuring a thickness, the method comprising: obtaining an original image of a structure, the structure including a first layer, the first layer including a first boundary and a second boundary, the original image including an image of the structure having the first layer, the second boundary being substantially indistinguishable in the original image; extracting the first boundary of the first layer in the original image; converting the original image into a first image based on the extracted first boundary; generating a second image, based on filtering the first image; extracting the second boundary of the first layer in the second image; and calculating a thickness of the first layer based on the extracted second boundary in the second image.
地址 Suwon-si KR