| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a semiconductor chip having an active surface and a non-active surface opposite to the active surface, an upper insulating layer provided on the non-active surface of semiconductor chip, and a via and a connection pad penetrating the semiconductor chip and the upper insulating layer, respectively. The connection pad has a first surface exposed outside the upper insulating layer and a second surface opposite to the first surface and facing the semiconductor chip. The first surface of the connection pad is coplanar with an upper surface of the upper insulating layer. |
| 申请公布号 |
US2017110388(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615290899 |
申请日期 |
2016.10.11 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
PARK Sang Cheon;LEE Won Il;JO Chajea;CHO Taeje |
| 分类号 |
H01L23/48;H01L23/522;H01L23/13;H01L23/00;H01L25/065;H01L23/528;H01L23/532 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip having an active surface and a non-active surface opposite to the active surface; an upper insulating layer provided on the non-active surface of the semiconductor chip; and a via and a connection pad penetrating the semiconductor chip and the upper insulating layer, respectively, wherein the connection pad has a first surface exposed outside the upper insulating layer, and a second surface opposite to the first surface and facing the semiconductor chip, and wherein the first surface of the connection pad is coplanar with an upper surface of the upper insulating layer. |
| 地址 |
Suwon-si KR |
