发明名称 |
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND PROCESS FOR MAKING THE SAME |
摘要 |
The present disclosure relates to a flip-chip package with a hollow-cavity and reinforced interconnects, and a process for making the same. The disclosed flip-chip package includes a substrate, a reinforcement layer over an upper surface of the substrate, a flip-chip die attached to the upper surface of the substrate by interconnects through the reinforcement layer, an air cavity formed between the substrate and the flip-chip die, and a protective layer encapsulating the flip-chip die and defining a perimeter of the air cavity. Herein, a first portion of each interconnect is encapsulated by the reinforcement layer and a second portion of each interconnect is exposed to the air cavity. The reinforcement layer provides reinforcement to each interconnect. |
申请公布号 |
US2017110434(A1) |
申请公布日期 |
2017.04.20 |
申请号 |
US201615085458 |
申请日期 |
2016.03.30 |
申请人 |
TriQuint Semiconductor, Inc. |
发明人 |
Railkar Tarak A.;Anderson Kevin J. |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus comprising:
a substrate having an upper surface with a plurality of substrate I/O pads; a reinforcement layer over the upper surface of the substrate; a flip-chip die having a die body and a plurality of interconnects extending outward from a bottom surface of the die body, wherein each of the plurality of interconnects connects to a corresponding one of the plurality of substrate I/O pads through the reinforcement layer and at least one portion of the reinforcement layer encapsulates a first portion of each of the plurality of interconnects; an air cavity formed between the bottom surface of the die body and the upper surface of the substrate; and a protective layer extending over a top surface of the die body, down side surfaces of the die body, and toward the upper surface of the substrate to define a perimeter of the air cavity, wherein a second portion of each of the plurality of interconnects is exposed to the air cavity. |
地址 |
Hillsboro OR US |