CAMERA MODULE HAVING BUFFER UNIT

摘要

A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

主权项

1. A camera module, comprising:
a wire connected with a first Printed Circuit Board (PCB); a housing unit comprising a base and connected with the first PCB; and a holder module disposed over the base, the holder module comprising:
an outer blade spaced from the housing unit;a bobbin disposed inside the outer blade; anda spring member connecting the bobbin to the outer blade; a first coil wound on an outer lateral surface of the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; and a solder unit comprising a first solder part disposed on one distal end of the wire to supply external power to the first coil through the first PCB and a second solder part disposed on the other end of the wire to be coupled with the holder module.