MICROELECTROMECHANICAL SYSTEM AND FABRICATING PROCESS

摘要

A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

主权项

1. A microelectromechanical system comprising an assembly of a plurality of layers stacked in a stacking direction comprising:
an active layer made of single-crystal silicon, said active layer comprising an active structure, and a first cover and a second cover defining a cavity around the active structure, the active layer being interposed between the first cover and the second cover, the second cover comprising a single layer made of single-crystal silicon, wherein the assembly further comprises a decoupling layer made of single-crystal silicon and comprising:
an attaching element intended to be fastened to a carrier,a frame encircling the attaching element in the plane of the decoupling layer, anda mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame, wherein the frame is secured to the silicon layer of the second cover and wherein at most one film of a material is interposed between said frame and said silicon layer of the second cover, the material being silicon dioxide.