| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a plurality of semiconductor switching elements disposed on a single semiconductor substrate comprising a semiconductor having a bandgap that is wider than that of silicon; and a plurality of electrode pads that are disposed in a predetermined planar layout on a front surface of the semiconductor substrate, the plurality of electrode pads each being electrically connected to the plurality of semiconductor switching elements. A plurality of terminal pins to externally carry out voltage of the electrode pads is bonded through a plated film to all of the plurality of electrode pads by solder. |
| 申请公布号 |
US2017111037(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615282215 |
申请日期 |
2016.09.30 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
SHIIGI Takashi;YAMADA Shoji;HARADA Yuichi;HOSHI Yasuyuki |
| 分类号 |
H03K17/081;H01L23/535;H01L23/498;H01L21/48;H01L23/00;H01L29/16;H01L21/66 |
主分类号 |
H03K17/081 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a plurality of semiconductor switching elements disposed on a single semiconductor substrate comprising a semiconductor material having a bandgap that is wider than that of silicon; and a plurality of electrode pads that are disposed in a predetermined planar layout on a front surface of the semiconductor substrate, the plurality of electrode pads each being electrically connected to the plurality of semiconductor switching elements, wherein a plurality of terminal pins to externally carry out voltage of the electrode pads is bonded through a plated film to all of the plurality of electrode pads by solder. |
| 地址 |
Kawasaki-shi JP |
