发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device, in which a plurality of control terminals that correspond to a main terminal and the same semiconductor chip protrude from a surface of an encapsulating part, and a plurality of signal paths that include the plurality of control terminals are positioned so as to be aligned with the main terminal in a first direction. Provided in each of the plurality of signal paths are pairs of relay members having identical functions, and a first relay grouping that includes one relay member of the pair of relay and a second relay grouping that includes the other relay member of the pair are positioned neighboring each other aligned in the first direction, with the ordering of the first relay grouping being mirror-inverted relative to the second relay grouping.
申请公布号 US2017110395(A1) 申请公布日期 2017.04.20
申请号 US201515128648 申请日期 2015.03.05
申请人 DENSO CORPORATION 发明人 IWABUCHI Akira;KANAMORI Atsushi;ONODA Kenji;OOMAE Syoichirou
分类号 H01L23/50;H02M7/00;H01L23/31;H02M7/537;H01L23/495;H01L25/07 主分类号 H01L23/50
代理机构 代理人
主权项 1. A semiconductor device comprising: at least one semiconductor chip on which a switching device is arranged and that includes a pair of main electrodes and a plurality of control electrodes; an encapsulating portion that encapsulates the at least one semiconductor chip; a plurality of main terminals that are electrically connected to the main electrodes and protrude from the encapsulating portion; a plurality of relay members that are respectively connected to the plurality of control electrodes; and a plurality of control terminals that are respectively electrically connected to the plurality of control electrodes through the plurality of relay members, generate a plurality of signal paths together with the respective relay members, and protrude from the encapsulating portion, wherein: the plurality of main terminals include first main terminals protruding from one face of the encapsulating portion, andsecond main terminals protruding from a face different from the one face; the plurality of control terminals corresponding to a same semiconductor chip protrude from the one face, the plurality of signal paths including the control terminals are arranged side by side in a first direction, and the first main terminals are arranged alongside the plurality of signal paths in the first direction; the relay members having a same function are provided in a pair at each of the plurality of signal paths arranged side by side with the first main terminals; and a first relay group including one of the pair of the relay members and a second relay group including another one of the pair are arranged next to each other along the first direction while an order of arrangement of the first relay group and the second relay group exhibits a mirror-inverted relationship.
地址 Kariya-city, Aichi-pref. JP