SERVICE TUNNEL FOR USE ON CAPITAL EQUIPMENT IN SEMICONDUCTOR MANUFACTURING AND RESEARCH FABS

摘要

A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

主权项

1. A cluster tool system for processing wafers, comprising:
a wafer transport assembly extending along a longitudinal axis of the cluster tool system; at least two process modules coupled to the wafer transport assembly along a lateral side of the wafer transport assembly, the wafer transport assembly being configured to transport wafers to and from the at least two process modules coupled along the lateral side; a service tunnel defined underneath the wafer transport assembly, the service tunnel extending along the longitudinal axis of the cluster tool system, the service tunnel having a vertical dimension defined between an underside of the wafer transport assembly and a service floor that is positioned underneath the wafer transport assembly.