| 发明名称 |
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A multilayer electronic component includes: a multilayer body includes stacked insulating layers and internal coil parts disposed on the insulating layers; external electrodes disposed on an outer portion of the multilayer body and connected to the internal coil parts; and a material layer disposed on an outermost coil part among the internal coil parts and having a specific resistance that is lower than a specific resistance of the internal coil parts. |
| 申请公布号 |
US2017110236(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615183035 |
申请日期 |
2016.06.15 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
JANG Su Bong;LEE Sang Jong;YUN Tae Ho;KIM Han |
| 分类号 |
H01F27/28;H01F41/04;H01F41/10;H01F27/29 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer electronic component, comprising:
a multilayer body comprising stacked insulating layers and internal coil parts disposed on the insulating layers; external electrodes disposed on an outer portion of the multilayer body and connected to the internal coil parts; and a material layer disposed on an outermost internal coil part among the internal coil parts and having a specific resistance that is lower than a specific resistance of the internal coil parts. |
| 地址 |
Suwon-si KR |
