Electrochemical deposition method

摘要

The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

主权项

1. A substrate holder for holding a substrate having a surface to be electroplated, said substrate holder comprising:
a fixed holding member; a movable holding member, the fixed holding member and the movable holding member being arranged and configured for holding the substrate therebetween, the movable holding member having a sealing member; and at least one pair of conductors for detecting a liquid leak, the at least one pair of conductors extending along an entire circumference of the sealing member and being located inside the sealing member spaced a distance from the substrate while the substrate is held between the movable holding member and the fixed holding member, the at least one pair of conductors having open first ends and having second ends to be connected to an electric resistance measuring device, the at least one pair of conductors being configured to short-circuit via a leaked plating solution when a plating solution leaks to a back side of the substrate held between the movable holding member and the fixed holding member.