Methods and apparatuses for selective chemical etching

摘要

Methods, apparatuses and systems are disclosed for chemically etching parts by generating an enclosed chemical etching chamber in contact with a part surface and directing a flow of chemical etchant solution in contact with a part region to be etched.

主权项

1. A method for chemically etching a part surface, the method comprising steps of:
positioning an etching device proximate to the part surface wherein said etching device comprises:
a chamber:a chamber boundary, said chamber boundary comprising an inner O-ring;at least one chamber inlet;at least one chamber outlet;an outer O-ring extending circumferentially about the chamber, said outer O-ring and inner O-ring defining an area between said outer O-ring and inner O-ring;a vacuum port located beyond the chamber boundary, said vacuum port in communication with a vacuum source; engaging the etching device to the part surface; delivering a negative pressure to the area between said outer O-ring and inner O-ring; sealing the etching device to the part surface; and directing a flow of etchant solution into the chamber inlet, such that the etchant solution contacts the part surface for a predetermined amount of time before exiting the chamber outlet.