| 发明名称 | Method and apparatus of making MEMS packages | ||
| 摘要 | MEMS packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board. The package includes a flexible wiring board mounted to a back surface of the module board and spanning across the opening in the module board. A die is mounted on the flexible wiring board and is encapsulated within an overmold. An air gap exists laterally between the overmold and side surface of the opening in the module board. | ||
| 申请公布号 | US9624093(B2) | 申请公布日期 | 2017.04.18 |
| 申请号 | US201414543468 | 申请日期 | 2014.11.17 |
| 申请人 | Apple Inc. | 发明人 | Jiang Tongbi;Zhai Jun |
| 分类号 | B81B7/00;B81C1/00 | 主分类号 | B81B7/00 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. A module comprising: a module board; an opening extending through and laterally surrounded by the module board; a package within the opening, wherein the package comprises: a flexible wiring board mounted on a back surface of the module board and spanning across the opening; anda micro-electro-mechanical systems (MEMS) die mounted on the flexible wiring board, wherein the MEMS die is encapsulated within an overmold and an air gap exists laterally between the overmold and side surfaces of the opening in the module board. | ||
| 地址 | Cupertino CA US | ||