发明名称 |
Solid electrolytic chip capacitor and manufacturing method thereof |
摘要 |
A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance. |
申请公布号 |
US9627149(B2) |
申请公布日期 |
2017.04.18 |
申请号 |
US201514886153 |
申请日期 |
2015.10.19 |
申请人 |
APAQ TECHNOLOGY CO., LTD. |
发明人 |
Chen Ming-Tsung;Wang Yi-Ying |
分类号 |
H01G9/15;H01G9/00;H01G9/04;H01G9/048;H01G9/042 |
主分类号 |
H01G9/15 |
代理机构 |
Li & Cai Intellectual Property (USA) Office |
代理人 |
Li & Cai Intellectual Property (USA) Office |
主权项 |
1. A solid electrolytic chip capacitor, comprising:
a substrate layer; an electrical insulating block formed on the substrate layer to define an anode region and a cathode region thereon; a conductive polymer layer formed to cover the cathode region of the substrate layer; a patterned reinforcement layer formed to cover the conductive polymer; and an electrode layer formed to cover the patterned reinforcement layer. |
地址 |
Miaoli County TW |