Memory devices with controllers under memory packages and associated systems and methods

摘要

Memory devices with controllers under stacks of memory packages and associated systems and methods are disclosed herein. In one embodiment, a memory device is configured to couple to a host and can include a substrate, a stack of memory packages, and a controller positioned between the stack and the substrate. The controller can manage data stored by the memory packages based on commands from the host.

主权项

1. A memory device, comprising:
a package substrate; a stack structure including
a stacked plurality of memory packages with semiconductor dies, wherein the stacked plurality of memory packages is attached to the package substrate, anda controller attached to the package substrate and positioned between the stacked plurality of memory packages and the package substrate, wherein the controller is configured to manage each of the memory packages; and an encapsulant attached to a periphery of the package substrate surrounding the stack structure, and the encapsulant encapsulating the stack of memory packages.