Method and apparatus of holding a device

摘要

Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.

主权项

1. A method, comprising:
placing a first wafer on a wafer chuck, wherein the wafer chuck includes first and second holes that extend therethrough, wherein the second hole is located closer to a center of the wafer chuck than the first hole; and varying a fluid pressure in each of the first and second holes independently and selectively to facilitate a wave-bonding of the first wafer with a second wafer, wherein the varying of the fluid pressure comprises:
creating a vacuum in the first and second holes at a first point in time;supplying a pressurized fluid to the second hole while maintaining the vacuum in the first hole at a second point in time after the first point in time in a manner such that a first portion of the first wafer disposed above the second hole is bent above and away from the wafer chuck; andsupplying the pressurized fluid to the first and second holes at a third point in time after the second point in time in a manner such that a second portion of the first wafer disposed above the first and second holes is bent above and away from the wafer chuck.