Method of encapsulating an electronic component

摘要

An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

主权项

1. A method of forming an encapsulated electronic assembly, said method comprising the steps of:
melting a thermoplastic encapsulant composition comprising polyamide and greater than 50 parts by weight of a filler based on 100 parts by weight of the composition; foaming the melted composition; injection molding the foamed composition against an electronic component; and solidifying the injected composition to form a foamed thermoplastic shell encapsulating the electronic component, the shell being substantially free of cells at an outermost skin thereof and at portions thereof contacting the electronic component, with remaining interior portions of the shell comprising evenly dispersed generally uniform cells.