Structure and method for replacement gate integration with self-aligned contacts

摘要

A method for fabricating a semiconductor device comprises forming a dummy gate on a substrate; forming spacers at opposing sides of the dummy gate; depositing a sacrificial interlayer dielectric over the dummy gate; planarizing the interlayer dielectric to expose the dummy gate; removing the dummy gate; forming a replacement metal gate with a protective cap between the spacers and on the substrate to replace the removed dummy gate; removing the sacrificial interlayer dielectric; siliciding exposed areas of the substrate adjacent to the replacement metal gate; depositing a final interlayer dielectric over the replacement metal gate and the exposed silicided areas; and forming vias through the final interlayer dielectric to the silicided areas.

主权项

1. An apparatus, comprising:
a semiconductor device located on a substrate, the semiconductor device having a replacement metal gate and a first set of spacers adjacent to the replacement metal gate and on opposing sides of the replacement metal gate and a second set of spacers adjacent to the first set of spacers, the second set of spacers comprising spacers that correspond to and protect the spacers of the first set of spacers; at least one silicided area on the substrate and adjacent to at least one of the spacers of the first set of spacers; and a self-aligned contact disposed over the replacement metal gate of the semiconductor device and in contact with the silicided area; wherein the at least one silicided area does not underlap the at least one spacer of the first set of spacers; and wherein the at least one silicided area does not underlap the spacers of the second set of spacers.