Structure and method for diminishing delamination of packaged semiconductor devices

摘要

A semiconductor device (100) comprising a leadframe with a pad (101) and elongated leads (103) made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip (110) attached to the pad, the chip having terminals. A metallic wire connection (130) from a terminal to a respective lead, the connection including a first ball bond by a first squashed ball (131) attached to the terminal, and a first stitch bond (132) attached to the lead. A second squashed ball (150) of the wire metal attached to the lead as a second ball bond adjacent to the first stitch bond (132). A package (170) of a polymeric compound encapsulating the chip, wire connection, second ball and at least a portion of the elongated lead, the compound adhering to the materials of the encapsulated entities.

主权项

1. A semiconductor device comprising:
a leadframe having a pad and elongated leads spaced from the pad by a gap, the leadframe made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip attached to the pad, the chip having terminals; a metallic wire connection, comprising a wire metal, from a terminal to a respective elongated lead, the connection including a first ball bond by a first squashed ball attached to the terminal, and a first stitch bond attached to the respective elongated lead; a second squashed ball, of the wire metal, attached to the respective elongated lead as a second ball bond adjacent to the first stitch bond; and a package of a polymeric compound encapsulating the chip, wire connection, second ball and a first portion of the respective elongated lead, and wherein a second portion of the respective elongated lead extends beyond the package, the compound adhering to the materials of the encapsulated entities.