发明名称 Multi-path devices with mutual inductance compensation networks and methods thereof
摘要 The embodiments described herein provide compensation for mutual inductance in a multi-path device. In one embodiment, a device includes a multi-path integrated device. The multi-path integrated device includes a first output and a second output. The first output is configured to be coupled to a first output lead through a first bonding wire, and the second output is configured to be coupled to a second output lead through a second bonding wire. Due to their proximity, the second bonding wire has a first mutual inductance with the first bonding wire. A first compensation network is coupled to the first output, and a second compensation network is coupled to the second output. The second compensation network is configured to have a second mutual inductance with the first compensation network. The second mutual inductance at least partially cancels the effects of the first mutual inductance.
申请公布号 US9628027(B2) 申请公布日期 2017.04.18
申请号 US201414211410 申请日期 2014.03.14
申请人 NXP USA, INC. 发明人 Embar Ramanujam Srinidhi;Holmes Damon G.;Staudinger Joseph
分类号 H03H7/38;H03F1/02;H03F3/195;H03F3/24;H03F3/68 主分类号 H03H7/38
代理机构 代理人
主权项 1. An apparatus comprising: a first output lead; a second output lead; a multi-path device, the multi-path device having a first amplifier with a first output, and a second amplifier with a second output; a first set of multiple parallel bonding wires coupling the first output of the first amplifier with the first output lead; a second set of multiple parallel bonding wires coupling the second output of the second amplifier with the second output lead, wherein the second set of bonding wires has a first mutual inductance with the first set of bonding wires; a first compensation network coupled in series with the first set of multiple parallel bonding wires between the first output and the first output lead; and a second compensation network coupled in series with the second set of multiple parallel bonding wires between the second output and the second output lead, the second compensation network configured to have a second mutual inductance with the first compensation network, the second mutual inductance configured to at least partially cancel effects of the first mutual inductance.
地址 Austin TX US