Packages and methods for forming the same

摘要

A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

主权项

1. A method comprising:
encapsulating a first package component in a molding compound, wherein the first package component is bonded to a second package component; evaluating a warpage status of the second package component and a third package component when the second package component is bonded to the third package component; determining a first horizontal size of a first opening and a second horizontal size of a second opening in a molding compound based on the warpage status; removing portions of the molding compound to form the first opening and the second opening in the molding compound, wherein the first opening and the second opening have the first horizontal size and the second horizontal size, respectively, and the first horizontal size and the second horizontal size are different from each other; and filling the first opening and the second opening with solder regions.