Semiconductor application installation adapted with a temperature equalization system

摘要

The primary purpose of the present invention is to provide an fluid circulating installation adapted with a temperature equalization system and fluid transmission duct disposed in a heat carrier existing in solid or liquid state in the nature where presents comparatively larger and more reliable heat carrying capacity. The fluid passes through the solid or gas state semiconductor application installation to regulate the semiconductor application installation for temperature equalization, and flows back to the heat equalization installation disposed in the natural heat carrier of heat for the heat equalization installation providing good heat conduction in the natural heat carrier to provide the operation of temperature equalization regulating function on the backflow of the fluid.

主权项

1. A semiconductor application installation adapted with a temperature equalization system, said semiconductor application installation including a heat dissipation structure in thermal contact with a semiconductor installation (103), said semiconductor installation including at least one of a light emitting diode (LED), a gas state lamp structure (1031), and a photovoltaic device (1032), comprising:
a support (600) that extends from an upper end above a surface of the earth to a lower end situated in a natural heat carrier (101) below a surface of the earth,
wherein said heat dissipation structure and said at least one of the light emitting diode (LED), gas state lamp structure (1031), and photovoltaic device (1032) are situated on the upper end of the support (600) for supporting said at least one of the light emitting diode, gas state lamp structure, and photovoltaic device, a heat equalizer (102) at the lower end of the support (600) made of a thermally conductive material in thermal contact with the natural heat carrier (101); at least one fluid transmission duct (105) including a first section for carrying a fluid (104) from the heat equalizer (102) to the heat dissipation structure, and a second section connected to the first section for carrying the fluid from the heat dissipation structure back to the heat equalizer (102), to thereby transfer thermal energy between the natural heat carrier (101) and at least one of the light emitting diode (LED), gas state lamp structure (1031), and photovoltaic device (1032),
wherein first and second sections of the fluid transmission duct (105) extend through said support (600) and are connected by a third fluid transmission duct section that extends through the semiconductor application installation via the interior or exterior of said heat dissipation structure to form a circuit for said fluid (104), andwherein only the first and second sections of the fluid transmission duct (105) that are above the natural heat carrier (101) are surrounded by a thermal insulating material (700); at least one pump (106) for pumping the fluid (104) through the fluid transmission duct (105); a control unit (110) for controlling operation of the at least one pump (106); a fluid transmission duct (105) for carrying a fluid (104) past the heat dissipation structure of the LED or photovoltaic device (1032), or past the gas state lamp structure (1031), to provide temperature equalization.