Robust interface bonding with B-staged thermoplastic polyimide adhesive

摘要

Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.

主权项

1. A heat activated adhesive thermoplastic laminating film for joining two surfaces comprising in combination:
A. a substrate; and B. a heat activated thermoplastic adhesive coated on said substrate, said adhesive comprising in combination:
i. a solvent; andii. a mixture of polyamic-acid polymer and thermoplastic polyimide polymer solids disposed in said solvent, said mixture containing no less than 10% and no greater than 50% thermoplastic polyimide of the total polymer mass and said mixture containing an amount of said solvent of between 20 and 60% of the total mass of the mixture, said adhesive forming a bondline between said surfaces; andwherein said laminating film is configured to outgas said solvent from said adhesive along said bondline upon the application of heat and pressure over the entire area of said surfaces to be bonded during a lamination process.