Package alignment structure and method of forming same

摘要

An embodiment is a semiconductor device comprising a first bond pad on a first substrate, the first bond pad having a first center line through a center of the first bond pad and orthogonal to a top surface of the first substrate, and a first conductive connector on a second substrate, the first conductive connector having a second center line through a center of the first conductive connector and orthogonal to a top surface of the second substrate, the second substrate over the first substrate with the top surface of the first substrate facing the top surface of the second substrate. The semiconductor device further comprises a first alignment component adjacent the first bond pad on the first substrate, the first alignment component configured to align the first center line with the second center line.

主权项

1. A semiconductor device comprising:
a first bond pad on a first substrate; a first conductive connector coupling the first bond pad of the first substrate to a second substrate the second substrate being over the first substrate with a top surface of the first substrate facing a top surface of the second substrate; a first alignment component adjacent the first bond pad on the top surface of the first substrate, the first alignment component having a rounded, convex top surface, the first alignment component configured to align the first bond pad with the first conductive connector, rounded portions of the rounded, convex top surface of the first alignment component directly adjoining the top surface of the first substrate, the rounded, convex top a surface of the first alignment component contacting a sidewall of the first conductive connector; a second alignment component adjacent a second side of the first bond pad on the top surface of the first substrate, the second alignment component having a rounded, convex top surface, the first alignment component being adjacent a first side of the first bond pad; a third alignment component adjacent a third side of the first bond pad on the top surface of the first substrate, the third alignment component having a rounded, convex top surface; a fourth alignment component adjacent a fourth side of the first bond pad on the top surface of the first substrate, the fourth alignment component having a rounded, convex top surface, the first, second, third, and fourth sides being different sides of the first bond pad, and each of the first, second, third, and fourth alignment components being physically separated from each other, the first, second, third, and fourth alignment components being a part of a first set of alignment components; a second set of alignment components having rounded, convex top surfaces on the top surface of the first substrate, each of the second set of alignment components being smaller than each of the first set of alignment components; a die mounted to the top surface of the first substrate with a second set of conductive connectors, each of the second set of alignment components being adjacent at least one of the second set of conductive connectors; and a fifth alignment component on the second substrate, the fifth alignment component over and contacting the first alignment component, the fifth alignment component having a rounded, convex top surface, wherein an apex of the rounded, convex top surface of the fifth alignment component contacts an apex of the rounded, convex top surface of the first alignment component.