Semiconductor housing with rear-side structuring

摘要

A semiconductor housing includes a fixing mechanism and at least one side having structurings. A method for producing a semiconductor device is provided in which a thermally conductive paste is applied on the at least one side of the semiconductor housing and/or of a heat sink. The semiconductor housing is fixed to the heat sink by means of the fixing mechanism. A pressure is exerted on the thermally conductive paste by means of the fixing mechanism and the thermally conductive paste is diverted by means of diversion channels depending on the pressure exerted.

主权项

1. A packaged semiconductor device comprising:
a housing configured to receive an external fastener for affixing the packaged semiconductor device to an external heat sink; a plurality of leads extending from one side of the housing; a plurality of trenches extending into a housing material at a side of an exterior surface of the housing; and a semiconductor device packaged inside the housing, wherein the exterior surface of the housing comprises a metallization layer of the semiconductor device, wherein the plurality of trenches is adapted to distribute a
thermally conductive paste when the housing is affixed to the external heat sink,wherein the semiconductor device is not disposed between the exterior surface of the housing and the external heat sink, wherein a first trench of the plurality of trenches is disposed between the plurality of leads and the metallization layer of the semiconductor device.