Thinning in package using separation structure as stop

摘要

A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.

主权项

1. A method of forming a thinned encapsulated chip structure, the method comprising:
forming a separation master structure arranged within a wafer; and singularising the wafer with its separation master structure into an electronic chip with its separation structure being formed by a portion of the separation master structure, and into at least one further electronic chip each having a further separation structure being formed by another portion of the separation master structure; encapsulating part of the electronic chip by an encapsulating structure; thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.