发明名称 Wireless chip
摘要 The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.
申请公布号 US9626618(B2) 申请公布日期 2017.04.18
申请号 US201615095549 申请日期 2016.04.11
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei;Izumi Konami
分类号 H01Q1/38;G06K19/077;G06K19/04;H01L27/12 主分类号 H01Q1/38
代理机构 Robinson Intellectual Property Law Office 代理人 Robinson Intellectual Property Law Office ;Robinson Eric J.
主权项 1. A semiconductor device comprising: an antenna; a circuit; and an organic resin, wherein the antenna comprises a conductive layer, wherein the conductive layer comprises: a first region;a second region;a third region between the first region and the second region;a fourth region between the first region and the third region; anda fifth region between the second region and the third region, wherein the conductive layer is bent so that a surface of the first region is parallel to a normal direction of the third region, and a surface of the second region is parallel to the normal direction of the third region, wherein the fourth region has a curved surface, wherein the fifth region has a curved surface, wherein the circuit is provided between the first region and the second region, and wherein the organic resin is in contact with the conductive layer.
地址 Kanagawa-ken JP