发明名称 Horizontally oriented and vertically stacked memory cells
摘要 Horizontally oriented and vertically stacked memory cells are described herein. One or more method embodiments include forming a vertical stack having a first insulator material, a first memory cell material on the first insulator material, a second insulator material on the first memory cell material, a second memory cell material on the second insulator material, and a third insulator material on the second memory cell material, forming an electrode adjacent a first side of the first memory cell material and a first side of the second memory cell material, and forming an electrode adjacent a second side of the first memory cell material and a second side of the second memory cell material.
申请公布号 US9627442(B2) 申请公布日期 2017.04.18
申请号 US201615138381 申请日期 2016.04.26
申请人 Micron Technology, Inc. 发明人 Quick Timothy A.;Marsh Eugene P.
分类号 H01L29/02;H01L27/24;H01L45/00 主分类号 H01L29/02
代理机构 Brooks, Cameron & Huebsch, PLLC 代理人 Brooks, Cameron & Huebsch, PLLC
主权项 1. A memory cell, comprising: a memory cell material having a recess formed therein; and an electrode conformally deposited in the recess in the memory cell material; wherein the memory cell material is a self-aligned memory cell material.
地址 Boise ID US