Semiconductor device and electronic device

摘要

A semiconductor device includes: a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.

主权项

1. A semiconductor device comprising:
a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate, the semiconductor chip including a field-programmable gate arrays circuit, a monitoring circuit that monitors a switching frequency of the field-programmable gate arrays circuit, and four heating circuits that are located in four corners of a surface of the semiconductor chip, wherein the monitoring circuit outputs an on-signal to the four heating circuits when the switching frequency of the field-programmable gate arrays circuit is equal to or less than a preset prescribed value, and the four heating circuits begin generating heat when the monitoring circuit outputs the on-signal.